X-ray inspection equipment - List of Manufacturers, Suppliers, Companies and Products

X-ray inspection equipment Product List

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X-ray fluoroscopy and CT scanner 'Cheetah EVO'

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

Inspection equipment effective for initial observation of various components and materials, including implementation substrates and electronic parts.

The "Cheetah EVO" is an X-ray imaging and CT inspection device equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system

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X-ray fluoroscopy and CT examination equipment: Case study of BGA solder crack analysis

X-ray fluoroscopy and CT examination equipment: Case study of BGA solder crack analysis

X-ray fluoroscopic observation, oblique CT observation, orthogonal CT observation, etc.! Introduction of BGA solder crack analysis cases.

We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection observed through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, making the condition of the abnormal areas clear. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system

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X-ray fluoroscopy and CT examination device: Observation case of a microphone

X-ray fluoroscopy and CT examination device: Observation case of a microphone

[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.

We will introduce a case of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounted substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphone] ■ X-ray Fluoroscopic Image - Wire bonding and wiring patterns of the mounted substrate can be observed. ■ Orthogonal CT Image - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

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[X-ray fluoroscopy and CT examination equipment] Examples of combined use of transmission observation and image processing technology.

[X-ray fluoroscopy and CT examination equipment] Examples of combined use of transmission observation and image processing technology.

Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmission observation and image processing technology.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmitted X-ray images of normal substrates and defective substrates, the wiring was intricately laid out, making it difficult to identify abnormalities at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon checking the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

X-ray fluoroscopy and CT scanner: Device appearance and main specifications

Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.

X-ray observation is a method of non-destructive testing and is the first inspection performed for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented substrates and electronic parts. Additionally, CT inspection can capture structures in three dimensions, allowing for visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, enabling real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

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Case Study Collection: X-ray Fluoroscopy and CT Examination Equipment

Case Study Collection: X-ray Fluoroscopy and CT Examination Equipment

Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" through X-ray fluoroscopy and oblique CT observation are included!

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopy and angled CT observation, as well as observations of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopy observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopy observation & orthogonal CT observation)... ★ Currently, we are offering a free collection of case studies on X-ray fluoroscopy and CT inspection equipment! You can view it immediately via "PDF download." * For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system
  • Other analytical equipment

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Observation of aluminum welding joints

Observation of aluminum welding joints

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

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